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Upgrading and upgrading of thin film resistor is promising.
Mar 15, 2018

Upgrading and upgrading of thin film resistor is promising.

The rapid development of electronic information technology drives the chip resistor into a period of rapid upgrading. In terms of the development direction of the chip resistor, the following are the following: super-miniaturization, green environmental protection, high precision, low temperature coefficient and base metallization.

Surface mount technology (SMT) is a new electronic product installation technology developed internationally in the late 1970s. It has been widely used in many kinds of electronic products and has revolutionized the installation technology of electronic products. Cooperate with surface mount technology, the development of the electronic component is also changing, and electronic component is the mainstream and development direction of electronic components, now all kinds of electronic components of the chip rate has reached more than 70%. In all kinds of the machine circuit, electronic component and the proportion of the number of active semiconductor device usually at 20:1 to 50:1, some of the high-end electronic products, such as mobile phone, notebook computer, PDA (PDA), such as electronic component ratio higher, sometimes can achieve 100:1.

Electronic components for surface mounting technology include chip resistors, chip capacitors, chip inductors, chip semiconductor devices, and other chip products. The demand of chip resistor is the biggest, accounting for more than 45% of the whole chip. The annual demand for global chip resistors is more than 1 trillion.

Since the 21st century, the rapid development of modern electronic information technology continuously put forward new requirements of component technology, especially the chip resistor technology also got new development, promotes the chip resistor into a period of rapid upgrade. In terms of the development direction of chip resistor, basically has the following several direction and microminiaturization, green environmental protection, high precision, low temperature coefficient and base metal, in order to help you understand something about the technology development of chip resistor, are thick diaphragm thin film chip resistors and resistor two categories make the following introduction, chip resistor is only for relevant personage reference.

Thick diaphragm type resistor is developed in 3 respects.

Thick film chip resistor is relative in terms of metal film resistor, resistive film layer is thick, thickness is commonly 4 mu mu m to 8 m, manufacturing process compared with the traditional columnar with fuses resistor, adopted a new manufacturing process. Chip resistor is usually used with 96% Al2O3 ceramic substrates for heat dissipation base material, Ag - Pd as conductor resistance materials, ruthenium and ruthenium oxide as to the material, glass glaze as coating material, end electroplating nickel, tin, etc. Through the screen printing technology, sintering technology, laser resistance technology, lobule technology, end coating technology, folding technology, electroplating technology and more than 30 production and inspection processes are carefully manufactured.

The main development direction of thick diaphragm type resistor is:

Super miniaturization. At present, 0402 and 0603 the size of the chip resistor has become the mainstream of the market, but with the electronic products, especially the light-duty miniaturization, digital products, 0201, 01005, the product demand is increasing, especially in 01005, the volume of the product is only 0.4 mm (length) x 0.2 mm (width) x 0.125 mm (high), weighs only 0.04 grams, now only a few Japanese and Taiwanese companies can produce in our country, in order to solve such as 01005 this small size production, it must upgrade on the traditional manufacturing process, such as silk screen printing technology must adopt the advanced CCD (CCDS) automatic counterpoint printing technology, the coating must adopt sputtering technique developed in recent years in solving the problem of end face and the laser trimming resistor, plating also must use the latest equipment to guarantee the batch production of 0201, 01005, products supply.

Green. The eu waste laws to electrical and electronic equipment (WEEE) and "about prohibiting certain hazardous substances in electrical and electronic equipment" rules (RoHS) has in August 2005 and came into effect on July 1, 2006, its influence in the global scope. Although the surface of glass glaze film falls within the scope of exemption, but try to reduce the use of glass glaze slurry for enterprise is can not only reduce the use of the environmental protection material, is also a good way to save money to reduce energy consumption, face sputtering base metal, the coating material by adopting the method of polymer resin have begun to gradually promote the use at present. According to statistics, the end face sputtering base metal can reduce the raw material cost of the product to reduce the cost by more than 90%. The use of polymer resin not only reduces the cost of raw materials, but also greatly improves the resistance of the product.

Ultra high resistance. Super high resistance chip resistor, mainly used in high performance electronic communication module, high precision electronic instrument and special military products. 1 t Ω highest resistance requirements, work up to 10 kv voltage highest requirement, the main characteristics of this kind of product has a resistance precision, working voltage, temperature coefficient, voltage coefficient, stability, etc., to ensure that the indicators meet the user requirements, must be a breakthrough in the technology, including the selection of slurry, adjustable resistance, coating material printing, etc., only after these technologies form a breakthrough, to guarantee the batch production, high resistance chip resistor.

Film chip resistor foreground is the most promising.

Thin film chip resistors is the most rapid development in recent years, the most widely application scope, the most promising prospect of a new generation of chip resistor, foreign companies have been batch production, a few years ago the Taiwan enterprises in our country is once upon a time two years began to batch production, but the mainland at present only a few manufacturers can produce such products. Compared with thick diaphragm type resistor, the resistance of the chip resistor film layer for nickel chromium alloy, precision processing and post processing, precision of resistance value can be up to + / - 0.05%, can achieve + / - 5 PPM / ℃ temperature coefficient, stability can be reached 0.02%, is instead of low precision of thick diaphragm resistor and traditional high precision, high stability of columnar ideal products with lead resistor. The production of thin film resistor is mainly in the following aspects.

Substrate. Film resistor film to remain in a stable condition generally need to work under 125 ℃, on the basis of the temperature rise every 10 ℃, the stability of the membrane layer can reduce 2% () in the air. In general, when the temperature at 125 ℃, the resistance of the drift is 0.5%, and when the temperature rises to 135 ℃, the drift value will reach 1%, this is because the oxygen in the air will be constantly oxidation resistance coatings. Of course, the factors that affect the temperature rise include the size of the resistor, the power, the surrounding components, the type of ceramic substrate and the use of the heat sink. At the same time, due to the thin film resistor film layer, the surface roughness and roughness of the porcelain film is also a decisive factor in the performance of the resistor.

So you must choose a kind of heat can be ensured by dissipative quickly, and can guarantee high surface roughness, roughness of good material, after the comparison, only 99.6% Al2O3 content of ceramic substrate can simultaneously meet the above requirements. At present, the ceramic substrate of this type has been mass-produced, mainly in some Japan and Taiwan.

Film forming. In the production of resistors, NiCr and tantalum (TaN) are commonly used as resistive film materials. The temperature coefficient of nickel-chromium material is relatively small, and the other side has a large resistance. Tantalum nitride has low resistance and the temperature coefficient is negative. Therefore, in actual production, the alloy composite film with nickel chromium as the main component is usually chosen.

Laser resistance. Chip resistor is used laser trimming resistor machine is developing very fast in recent years, the fourth generation of chip resistor USES laser trimming resistor machine for production, and is dedicated to membrane chip resistor, laser wavelength of 532 nm green laser trimming resistor machine production, there have been many companies value control precision can reach + / - 0.02%, the resistance rate of up to 300 mm/s, entirely suitable for mass production of thin film chip resistors.

Face processing. Face processing technology in recent years were also upgraded, the use of the ribs and sputtering machine, makes the previous face silver technology upgrading for the end sputtering nickel chrome metal, not only reduces the cost, improve the efficiency, also greatly improve the stability and reliability of the products.

In short, from the overall industrial level, there is a certain gap between China's continental chip components industry and the United States and Japan. Electronic components manufacturing enterprises are facing a common problem is the core competitiveness of poor, low product class, and product technology content is low, low added value, with independent intellectual property rights of products less, on some core technology also disciplined by others. However, the rapid development of chip components, the rise of the passive integrated industry and the adjustment of industrial structure around the world have provided a better opportunity for the development of the chip components industry in China. It is the only way for our country to move from the power of electronic components to the power of electronic components to seize these opportunities and invest in the development of a new generation of components with independent intellectual property rights.